Wafer level stack structure for system-in-package and method thereof

ABSTRACT

A wafer level stack structure, including a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input/output (I/O) pads, a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I/O pads, wherein the at least one second device chip is increased to the first chip size, wherein the first wafer and the second wafer are stacked, and wherein the first wafer and the second wafer are coupled to each other. A method of forming a wafer level stack structure, including forming a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input/output (I/O) pads, forming a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I/O pads, wherein the at least one second device chip is increased to the first chip size, stacking the first wafer and the second wafer, and coupling the first wafer and the second wafer to each other. A system-in-package, including a wafer level stack structure including at least one first device chip with a first plurality of input/output (I/O) pads and at least one second device chip with a second plurality of I/O pads, and a common circuit board to which the wafer level stack structure is connected. A method of forming a system-in-package for containing a wafer level stack structure, including forming a wafer level stack structure including at least one first device chip having a first plurality of input/output (I/O) pads and at least one second device chip having a second plurality of I/O pads, and forming a common circuit board to which the wafer level stack structure is connected.

CROSS REFERENCE TO RELATED APPLICATIONS

This U.S. non-provisional application claims the benefit of priorityunder 35 U.S.C. §119 to Korean Patent Application No. 2003-82227 filedNov. 19, 2003, the contents of which are incorporated herein in itsentirety by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to electronic packaging technology andmore generally, to a wafer level stack structure in a system-in-packageand method thereof.

2. Description of the Related Art

An electronic package, which may be referred to as a semiconductorpackage, may be defined as the housing and interconnection of integratedcircuits, which may be referred to as the chip or the die, which mayform an electronic system. The electronic package may include astructure to physically support the chip, a physical housing to protectthe chip from the environment, a means of heat dissipation, andelectrical connections to allow signal and power access to and from thechip. Packaging technology may be a factor in the determination of theprice, performance, and reliability of a final semiconductor product.

Three-dimensional stack technology is a method of creating semiconductorpackages currently used in the art. A chip stack that utilizesthree-dimensional stack technology may be fabricated at the chip levelby conventional methods. However, a wafer level fabrication techniquehas been recently developed to achieve simpler, more cost-effective chipstack packages.

The Wafer-Level Chip-Scale Package (WLCSP) is a type of packaging whichenables the integrated circuit (IC) to be attached to a circuit boardface-down, with the chip's pads connecting to the circuit board's padsthrough individual solder balls without needing any underfill material.This technology differs from other packaging technologies because thereare no bond wires or interposer connections. An advantage of the WLCSPis a reduction of inductance in the electronic device being packaged.Other benefits of the WLCSP may include a reduction in package size,manufacturing cycle time and enhanced thermal conductioncharacteristics.

System-in-package (SIP) is a technology which may allow integratedsingle packaging of different kinds of electronic devices. SIP may offerincreases in the performance and function of semiconductor devices whiledecreasing their size and/or cost.

FIG. 1 illustrates a cross-sectional view of a SIP using a chip levelstack technique according to conventional methods. Referring to FIG. 1,the SIP 10 may include electronic devices of different sizes illustratedby elements 12, 13 and 14. The elements 12, 13 and 14 are stacked on acommon circuit board 11, attached with an adhesive 15, and electricallycoupled to the common circuit board 11 with bonding wires 16. Anencapsulant 17, such as an epoxy resin, is provided on an upper surfaceof the board 11 to protect the devices 12, 13, 14 and the wires 16. Aplurality of solder balls 18 may be included on a lower surface of thecommon circuit board 11.

FIG. 2 illustrates a plan view of device chips of the SIP of FIG. 1according to conventional methods. The device chips 12, 13 and 14 arenot typically aligned with each other. Specifically, the number ofinput/output (I/O) pads 12 a, 13 a and 14 a, etc., may differ fromdevice chip to device chip.

The conventional SIP 10 is currently limited to application at the chiplevel only. Thus, there is currently no method of applying WLCSP to aSIP.

SUMMARY OF THE INVENTION

An exemplary embodiment of the present invention is a wafer level stackstructure comprising a first wafer including at least one first devicechip, wherein each first device chip contains a first plurality ofinput/output (I/O) pads, a second wafer including at least one seconddevice chip, wherein each second device chip contains a second pluralityof I/O pads, wherein the first wafer and the second wafer are stackedand wherein the first wafer and the second wafer are coupled to eachother.

Another exemplary embodiment of the present invention is a method offorming a wafer level stack structure comprising forming a first waferincluding at least one first device chip, wherein each first device chipcontains a first plurality of input/output (I/O) pads, forming a secondwafer including at least one second device chip, wherein each seconddevice chip contains a second plurality of I/O pads, stacking the firstwafer and the second wafer, and coupling the first wafer and the secondwafer to each other.

Another exemplary embodiment of the present invention is asystem-in-package, comprising a wafer level stack structure including atleast one first device chip with a first plurality of input/output (I/O)pads and at least one second device chip with a second plurality of I/Opads, and a common circuit board to which the wafer level stackstructure is connected.

Another exemplary embodiment of the present invention is a method offorming a system-in-package for containing a wafer level stackstructure, comprising forming a wafer level stack structure including atleast one first device chip having a first plurality of input/output(I/O) pads and at least one second de-vice chip having a secondplurality of I/O pads, and forming a common circuit board to which thewafer level stack structure is connected.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more apparent by describing in detailexemplary embodiments thereof with reference to the attached drawings inwhich:

FIG. 1 illustrates a cross-sectional view of a system-in-package (SIP)using a chip level stack technique according to conventional methods.

FIG. 2 illustrates a plan view of device chips of the SIP of FIG. 1according to conventional methods.

FIG. 3 illustrates a plan view of device chips of different device typesaccording to an exemplary embodiment of the present invention.

FIG. 4 illustrates a wafer level stack structure comprising device chipsof different types according to an exemplary embodiment of the presentinvention.

FIGS. 5A-5F illustrate s cross-sectional views of a wafer level stackstructure comprising different types of device chips according to anexemplary embodiment of the present invention.

FIG. 5G illustrates a resultant wafer level stack structure fabricatedfrom the methods illustrated in FIGS. 5A-5F.

FIG. 6 illustrates a cross-sectional view of a system-in-package (SIP)50 including a wafer level stack structure according to an exemplaryembodiment of the present invention.

FIG. 7 illustrates a cross-sectional view of a wafer level stackstructure comprising device chips of different device types according toanother exemplary embodiment of the present invention.

FIG. 8 illustrates a cross-sectional view of a wafer level stackstructure comprising device chips of different device types according toanother exemplary embodiment of the present invention.

FIG. 9 illustrates a cross-sectional view of a system-in-package (SIP)including a wafer level stack structure according to another exemplaryembodiment of the present invention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE INVENTION

Hereinafter, exemplary embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings.

In the Figures, the same reference numerals are used to denotecorresponding elements throughout the Figures. It will be furtherappreciated that the figures are not drawn to scale. Rather, forsimplicity and clarity of illustration, the dimensions of some of theelements are exaggerated relative to other elements.

In the description, well-known structures and processes have not beendescribed or illustrated in detail to avoid obscuring the presentinvention. Further, the term “device-type” employed herein refers to oneof a plurality of device types. For example, device types may includememory devices such as DRAM, SRAM, flash memory, or non-memory devicessuch as the CPU, ASIC, and other devices.

Chip Layout

FIG. 3 illustrates a plan view of device chips of different device typesaccording to an exemplary embodiment of the present invention.

As shown in FIG. 3, the device chips 21, 31 and 41 may be formed with afirst chip size, irrespective of the device types of device chips 21, 31and 41, respectively. Further, the first chip size of the device chips21, 31 and 41 are substantially equal to or slightly larger than thechip size of the device 14 of FIGS. 1-2, where the device 14 is thelargest of devices 12-14. The device 14 may have a chip size equivalentto the first chip size, the device 13 may have a second chip size, andthe device 12 may have a third chip size.

As shown, the first chip size of the first device chip 21 issubstantially equal to the first chip size of the device chip 14, andtherefore device chip 14 may require no peripheral region for extendingthe first chip size of device chip 14. A second device chip 31 may beextended to the first chip size by adding a first peripheral region 33to a first device region 32, which may have the second chip size beingless than the first chip size and may contain device chip 13. Similarly,a third device chip 41 may be extended to the first chip size by addinga second peripheral region 43 to a smaller second device region 42,which may have the third chip size being less than the first chip sizeand may contain device chip 12.

As discussed above, the device chips 21, 31 and 41 may each be adifferent device type while being formed to the first chip size. Inaddition, each of the device chips 21, 31 and 41 may have vias 25, 35and 45, respectively. The vias 25, 35, and 45 may be formed so that eachof the vias 25, 35 and 45 are aligned when the device chips 21, 31 and41, respectively, are stacked. The vias 25, 35 and 45 are formed nearedges of the device chips 21, 31 and 41, respectively. Therefore, thevias 35 of the second device chip 31 and the vias 45 of the third devicechip 41 may be formed within the peripheral regions 33 and 43. Each viawithin vias 25, 35 and 45 may be an interconnection path through devicechips 21, 31 and 41, respectively, formed by conductive material thatfill a hole which may be vertically bored through the device chips 21,31 and 41.

The device regions 22, 32 and 42 may be fabricated similar toconventional device chips, and the input/output (I/O) pads 24, 34 and 44may be formed at the same position as in conventional device chips. Thevias 25 of the first device chip 21 may be provided just at the I/O pads24. However, the vias 35 and 45 of the second device chip 31 and thirddevice chip 41 may be formed at positions different from the I/O pads 34and 44. Therefore, rerouting lines 36 and 46 may be formed between thevias 35 and 45 and the I/O pads 34 and 44 in order to electricallyconnect the I/O pads 34 and 44 with the vias 35 and 45, respectively.

The first peripheral region 33 and the second peripheral region 43 maycontain no internal circuitry, similar to scribe lanes which will bedescribed later with reference to FIGS. 5A-5G. The first peripheralregion 33 and the second peripheral region 43 may be formed as anextension of the scribe lanes. Therefore, no additional function may berequired for the peripheral regions 33 and 43 beyond serving to extenddevice regions 32 and 42 to the first chip size.

In another exemplary embodiment of the present invention, the firstdevice chip 21 may have a peripheral region similar to the peripheralregions 33 and 43 with respect to the second device chip 31 and thirddevice chip 41 as described above. Such an exemplary embodiment is shownin FIG. 7, which will be described later.

In an exemplary embodiment of the present invention, device chips 21, 31and 41 may be different device types while being formed to the firstchip size, which may enable the device chips 21, 31 and 41 to bestacked. Further, a system-in-package may be formed, including the waferlevel stack structure.

Wafer Level Stack Structure Formation

FIG. 4 illustrates a wafer level stack structure comprising device chipsof different types according to an exemplary embodiment of the presentinvention. As shown in FIG. 4, the stacked device chips 21, 31 and 41have the first chip size.

Electrical connections between the stacked device chips 21, 31 and 41are established by connection bumps 27, 37 and 47, respectively, as wellas the vias 25, 35 and 45, respectively. The vias 25, 35 and 45 of thedevice chips 21, 31 and 41, respectively, may be aligned. The connectionbumps 27, 37 and 47 may be formed under the vias 25, 35 and 45,respectively, before the device chips 21, 31 and 41 are stacked. Whenthe device chips 21, 31 and 41 are stacked, the connection bumps ofdevice chips on the stack are attached and joined to the vias ofadjacent device chips with a lower relative position on the stack. Forexample, as shown in FIG. 4, device chip 21 has a lower position on thestack as compared to device chip 31, and further is adjacent to devicechip 31. Further, the vias 35 and 45 of the second device chip 31 andthird device chip 41, respectively, may be electrically coupled to theI/O pads 34 and 44 through the rerouting lines 36 and 46.

The I/O pads 24, 34 and 44 may each be different in number. The vias 25,35 and 45, the rerouting lines 36 and 46, and/or the connection bumps27, 37 and 47 may be used for heat dissipation as well as electricalconnections. Further, the vias 25, 35 and 45, the rerouting lines 36 and46, and/or the connection bumps 27, 37 and 47 may be used for chipselection of the stacked device chips. The vias 25, 35 and 45, thererouting lines 36 and 46, and/or the connection bumps 27, 37 and 47 mayalso be used as mechanical supports, without electrical connections,between the adjacent upper and lower device chips.

Structure Including Device Chips of Different Device Types

In an exemplary embodiment of the present invention, the stack structureof the device chips 21, 31, and 41 shown in FIG. 4 may be fabricated atthe wafer level.

FIGS. 5A-5F illustrate cross-sectional views of a wafer level stackstructure comprising different types of device chips according to anexemplary embodiment of the present invention. FIG. 5G illustrates aresultant wafer level stack structure fabricated from the methodsillustrated in FIGS. 5A-5F.

FIG. 5A illustrates wafers 20, 30 and 40. Each one of wafer 20, 30 and40 may contain a plurality of device chips 21, 31 and 41, respectively,which may be separated by scribe lanes 28, 38 and 48. Although thescribe lanes are illustrated as lines, those skilled in the art willappreciate that the scribe lanes may be formed as narrow regions. Eachone of wafer 20, 30 and 40 may be fabricated independently based on thetype of device chip contained within each wafer 20, 30 and 40. Waferfabrication processes are well known in this art, and will not bediscussed further.

In an exemplary embodiment of the present invention, the first wafer 20may contain a plurality of first device chips 21 separated by scribelanes 28. Each of the plurality of first device chips 21 may be composedof the device region 22 only. The I/O pads 24 may be formed near edgesof the device region 22 in this exemplary embodiment of the presentinvention. However, in another exemplary embodiment of the presentinvention illustrated in FIG. 7, the first device chip 21-1 may have aperipheral region 23.

In another exemplary embodiment of the present invention, the secondwafer 30 may contain a plurality of second device chips 31 separated byscribe lanes 38. Each of the plurality of second device chip 31 maycomprise the device region 32 and the peripheral region 33. The deviceregion 32 may correspond to the above-described second device chip 13illustrated in FIG. 2. The I/O pads 34 may be formed near edges of thedevice region 32 in this exemplary embodiment of the present invention.

In another exemplary embodiment of the present invention, the thirdwafer 40 may contain a plurality of third device chips 41 separated byscribe lanes 48. Each of the plurality of third device chips 41 maycomprise the device region 42 and the peripheral region 43. The deviceregion 42 may correspond to the above-described third 12 illustrated inFIG. 2. The I/O pads 44 may be formed near edges of the device region 42in this exemplary embodiment of the present invention.

As shown in FIG. 5B, a plurality of via holes 25 a, 35 a and 45 a may beformed near chip edges within the device chips 21, 31 and 41,respectively. The corresponding upper and lower via holes 25 a, 35 a and45 a may be aligned. Therefore, the via holes 25 a of the first devicechip 21 may be formed at the I/O pads 24 in FIG. 5A. However, the viaholes 35 a and 45 a of the second device chip 32 and the third devicechip 42 may be formed within the peripheral regions 33 and 43,respectively. This may be necessary in order to properly align thedevice chips when they are stacked. If the first device chip 21-1contains the peripheral region 23 as illustrated in FIG. 7, the viaholes 25 a of the first device chip 21-1 may be formed within theperipheral region 23. The via holes 25 a, 35 a and 45 a may be formed bylaser drilling and/or any other conventional technique well known in theart.

As illustrated in FIG. 5C, the via holes may be filled with a conductivematerial, thereby forming the vias 25, 35 and 45. The vias 25, 35 and 45act as electrical paths between the stacked device chips 21, 31 and 41,respectively. Further, the vias 25, 35 and 45 may be used for heatdissipation and/or chip selection.

As shown in FIG. 5D, the rerouting lines 36 and 46 may be formed betweenthe vias 35 and 45 and the I/O pads 34 and 44 of the second device chip31 and third device chip 41, respectively. The rerouting lines 36 and 46may also be used for heat dissipation and/or chip selection.

As shown in FIG. 5E, the connection bumps 27, 37 and 47 may be formedunder the vias 25, 35 and 15, respectively, providing mechanical and/orelectrical connections between the wafers 20, 30 and 40. Some of theconnection bumps 27, 37 and 47 may be used solely as mechanicalsupports, and not as electrical connections. Further, the connectionbumps 27, 37 and 47 may be formed above the vias. This exemplaryembodiment of the present invention will be discussed in detail below.

As shown in FIG. 5F, the wafers 20, 30 and 40 may be stacked. When thewafers 20, 30 and 40 are stacked, the connection bumps 37 and 47 of therelatively upper wafer 30 may be attached and joined to the vias 25 ofthe relatively lower wafer 20, and the relatively upper wafer 40 may beattached and joined to the vias 35 of the relatively lower wafer 30.

In an exemplary embodiment of the present invention, the stacked wafers20, 30 and 40 may be simultaneously sawed along the scribe lanes 28, 38and 48, thereby forming a plurality of stacks of the device chips ofdifferent device types. Accordingly, the above described method offorming a wafer level stack structure may provide an improvement inproductivity and a reduction in production cost in comparison with theconventional chip level stack method.

System-in-Package Including Wafer Level Stack Structure

FIG. 6 illustrates a cross-sectional view of a system-in-package (SIP)50 including a wafer level stack structure according to an exemplaryembodiment of the present invention.

Referring to FIG. 6, a wafer level stack structure comprising the devicechips 21, 31 and 41 may be formed on a common circuit board 51. Thecommon circuit board 51 may be a printed circuit board (PCB) or anyother structure well known in this art. The wafer level stack structuremay be directly connected to the board common circuit 51 through theconnection bumps 27 of the first device chip 21. Electricalinterconnections between the respective device chips 21, 31 and 41 andbetween the wafer level stack structure and the common circuit board 51may be made through the vias 25, 35 and 45, the rerouting lines 26, 36and 46, and/or the connection bumps 27, 37 and 47, respectively.Therefore, the SIP 50 of FIG. 6 may have shorter interconnection pathsthan the conventional SIP 10 in FIG. 1.

An encapsulant 57, such as an epoxy resin, may be formed on an uppersurface of the common circuit board 51 to protect the wafer level stackstructure from the external conditions, and solder balls 58 may beformed on a lower surface of the common circuit board 51 in order toform external connections to a next-level common circuit board (notshown).

Example of Wafer Level Stack Structure

FIG. 7 illustrates a cross-sectional view of a wafer level stackstructure comprising device chips of different device types according toanother exemplary embodiment of the present invention. FIG. 7 maycorrespond to FIG. 5D which illustrates intermediate products of thewafer level stack structure during fabrication.

Referring to FIG. 7, the wafer level stack structure may comprise threekinds of wafers represented by wafers 20-1, 30-1 and 40-1. Each firstdevice chip 21-1, may be contained in the first wafer 20-1, and may havea peripheral region 23, similar to the peripheral regions 33 and 44 ofthe second device chip 31-1 and third device chip 41-1, respectively.The first device chip 21-1 may also contain rerouting lines 26, similarto rerouting lines 36 and 46, that connect the I/O pads 24 with the vias25.

Another Example of Wafer Level Stack Structure

FIG. 8 illustrates a cross-sectional view of a wafer level stackstructure comprising device chips of different device types according toanother exemplary embodiment of the present invention. FIG. 8 maycorrespond to FIG. 5F which illustrates intermediate products of thewafer level stack structure during fabrication.

Referring to FIG. 8, the wafer level stack structure of wafers 20-2,30-2 and 40-2 may be characterized by upper and lower connection bumps27 a, 27 b, 37 a and 37 b of the first device chip 21 and the seconddevice chip 31, respectively. When the wafers are stacked, the upperconnection bumps 27 a on the first wafer 20-2 may be joined to the lowerconnection bumps 37 b under the second wafer 30-2, and the upperconnection bumps 37 a on the second wafer 30-2 are joined to theconnection bumps 47 under the third wafer 40-2.

Another Example of System-in-Package

FIG. 9 illustrates a cross-sectional view of a system-in-package (SIP)including a wafer level stack structure according to another exemplaryembodiment of the present invention.

Referring to FIG. 9, within the SIP 50-1, device chips 21-2, 31-2 and41-2 may be mounted to the common circuit board 51 in a flip-chipfashion so that the I/O pads 24, 34 and 44 may face toward the commoncircuit board 51. During the fabrication of the wafer level stackstructure, the connection bumps 27, 37 and 47 may be formed above thedevice chips 21-2, 31-2 and 41-2, respectively, and not underneath thedevice chips 21-2, 31-2 and 41-2. The wafer level stack structure maythen be flipped over and connected to the common circuit board 51. Insuch a wafer level stack structure, the third device chip 41-2 may haveno vias.

The exemplary embodiments of the present invention being thus described,it will be obvious that the same may be varied in many ways. Forexample, while above exemplary embodiments describe a wafer level stackstructure comprising three wafers, the number of stacked wafers may begreater or less than three and still remain within the scope of thepresent invention.

Such variations are not to be regarded as a departure from the spiritand scope of the exemplary embodiments of the present invention, and allsuch modifications as would be obvious to one skilled in the art areintended to be included within the scope of the following claims.

1-34. (canceled)
 35. A wafer level stack structure comprising: a first wafer including at least one first device chip, wherein each first device chip includes a first device region having a first plurality of input/output (I/O) pads; a second wafer including at least one second device chip, wherein each second device chip includes a second device region having a second plurality of input/output (I/O) pads and a second peripheral region; and wherein the first wafer and the second wafer are stacked and coupled to each other.
 36. The wafer level stack structure of claim 35, wherein the at least one second device chip is substantially equal in size to the at least one first device chip.
 37. The wafer level stack structure of claim 35, wherein the second wafer includes a plurality of through vias.
 38. The wafer level stack structure of claim 37, wherein the second wafer includes rerouting lines extending from the device region to the peripheral region and connected to the plurality of through vias.
 39. The wafer level stack structure of claim 38, wherein the second wafer includes the input/output (I/O) pads connected to the rerouting lines.
 40. The wafer level stack structure of claim 37, wherein each of the second device chips contains a plurality of connection bumps connecting to the plurality of through vias.
 41. The wafer level stack structure of claim 37, wherein each second device chip includes a second device region in size different from the first device region.
 42. The wafer level stack structure of claim 41, wherein each second device chip includes a second device region smaller in size than the first device region
 43. The wafer level stack structure of claim 35, wherein the first wafer further includes a plurality of through vias.
 44. The wafer level stack structure of claim 35, wherein the first wafer includes no rerouting lines.
 45. The wafer level stack structure of claim 43, wherein each of the first device chips contains a plurality of connection bumps connecting to the plurality of through vias.
 46. The wafer level stack structure of claim 35: wherein each of the first and second device chips includes a first surface and a second surface opposite to the first surface; wherein each of the first surfaces includes I/O pads; wherein the first surface of the first device chip is opposed to the first surface of the second device chip.
 47. The wafer level stack structure of claim 35, wherein a distance between the edge of the first device chip and first input/output (I/O) pads of the first device chip is different from a distance between the edge of the second device chip and second input/output pads of the second device chip.
 48. The wafer level stack structure of claim 35, further comprising: a third wafer stacked with and coupled to the first wafer and the second wafer; wherein the third wafer includes at least one third device chip; wherein the at least one third device chip includes a third device region having a third plurality of input/output (I/O) pads and a third peripheral region; wherein the first device region and the third device region are substantially not equal in size.
 49. The wafer level stack structure of claim 48, wherein the second region and the third device region are substantially equal or not in size.
 50. The wafer level stack structure of claim 48, wherein each of the at least one second device chip and the at least one third device chip is substantially equal in size to the at least one first device chip.
 51. The wafer level stack structure of claim 48, wherein each chip of the second wafer and the third wafer includes a plurality of through vias.
 52. The wafer level stack structure of claim 51, wherein each chip of the second wafer and the third wafer includes rerouting lines connected to the plurality of through vias.
 53. The wafer level stack structure of claim 43, wherein each chip of the second wafer and the third wafer includes a plurality of input/output (I/O) pads connected to the rerouting lines.
 54. The wafer level stack structure of claim 51, wherein each of the second device chips and the third device chips contains a plurality of connection bumps connecting to the plurality of through vias.
 55. The wafer level stack structure of claim 48, wherein a distance between the edge of the first device chip and first input/output (I/O) pads of the first device chip is different from a distance between the edge of the second device chip and second input/output pads of the second device chip.
 56. The wafer level stack structure of claim 55, wherein a distance between the edge of the first device chip and first input/output pads of the first device chip is different from or not a distance between the edge of the third device chip and third input/output (I/O) pads of the third device chip.
 57. The wafer level stack structure of claim 48, wherein the first chip includes a plurality of no through vias.
 58. The wafer level stack structure of claim 57, wherein the first chip includes no rerouting lines.
 59. The wafer level stack structure of claim 48, wherein each of the first device chips contains a plurality of connection bumps connecting to the plurality of through vias.
 60. The wafer level stack structure of claim 48: wherein each of the first, second and third device chips includes a first surface and a second surface opposite to the first surface; wherein each of the first surfaces includes I/O pads; wherein the first surface of the first device chip is opposed to the first surface of the second device chip and the second surface of the second device chip is opposed to the first surface of the third device chip.
 61. A system-in-package, comprising: a wafer level stack structure including: at least one first device chip including a first device region having a plurality of input/output (I/O) pads, and at least one second device chip including a second device region having a plurality of input/output (I/O) pads and a second peripheral region surrounding the second device region; wherein the size of the second device region is different from the size of the first device region; wherein the at least one first device chip and the at least one second device chip have approximately equal size; and a common circuit board to which the wafer level stack structure is connected.
 62. The system-in-package of claim 61, wherein the at least one second device chip includes a plurality of rerouting lines extending from the device region to the peripheral region.
 63. The system-in-package of claim 62, wherein the at least one second device chip contains a plurality of connection bumps connecting to the plurality of through vias.
 64. The system-in-package of claim 61, wherein the first device chip and the second device chip are different device types.
 65. The system-in-package of claim 64, wherein the first device chip is a non-memory device and the second device chip is a memory device.
 66. The system-in-package of claim 61, wherein each of the first and second device chips are stacked.
 67. The system-in-package of claim 61, further comprising: at least one third device chip including a third device region having a plurality of input/output (I/O) pads and a third peripheral region surrounding the third device region; wherein the size of the third device region is different from the size of the second device region.
 68. The system-in-package of claim 67, wherein the at least one third device chip includes a plurality of rerouting lines extending from the device region to the peripheral region, a plurality of through vias and connection bumps connecting to the plurality of through vias.
 69. A system-in-package, comprising: a wafer level stack structure including: at least one first device chip with a first plurality of I/O pads; at least one second device chip with a second plurality of I/O pads; wherein the at least one first device chip and the at least one second device chip are substantially the same size and the first plurality of I/O pads and the second plurality of I/O pads are not overlapped; and a common circuit board to which the wafer level stack structure is connected.
 70. The system-in-package of claim 69, wherein the at least one second device chip includes a plurality of rerouting lines connected to input/output (I/O) pads and a plurality of through vias.
 71. The system-in-package of claim 69, wherein the first device chip and the second device chip are different device types.
 72. The system-in-package of claim 71, wherein the first device chip is a non-memory device and the second device chip is a memory device.
 73. The system-in-package of claim 69, wherein each of the first and second device chips are stacked.
 74. The system-in-package of claim 69, further comprising: at least one third device chip with a third plurality of I/O pads; wherein the at least one first device chip, the at least one second device chip and at least one third device chip are substantially the same size and the second plurality of I/O pads and the third plurality of I/O pads are not overlapped.
 75. The system-in-package of claim 74, wherein the at least one third device chip includes the plurality of rerouting lines connected to input/output (I/O) pads, a plurality of through vias and a plurality of connecting bumps.
 76. A system-in-package including the wafer level stack structure of claim
 35. 77. A system-in-package, comprising: a wafer level stack structure including: at least one first device chip including a first device region; wherein the first device chip includes a first plurality of input/output (I/O) pads on the first device region; at least one second device chip including a second device region having a smaller size than the first device region and a second peripheral region surrounding the second device region, wherein the at least one first device chip and the at least one second device chip have approximately equal size; wherein the second device chip includes a second plurality of input/output (I/O) pads on the second device region; wherein the second device chip includes a plurality of through vias in the second peripheral region; and a common circuit board to which the wafer level stack structure is connected. 